SEOUL, South Korea / RankWire.AI / – Samsung Electronics introduced its next-generation approach to memory and storage solutions tailored for artificial intelligence infrastructure during the 2026 OCP Global Summit. The company showcased its plans at the event held in San Jose, California, from October 12 to 15, highlighting three key technological directions: high-performance memory, Compute Express Link-based memory expansion, and next-generation solid-state drives. Additionally, Samsung announced a collaborative CXL demonstration with Advanced Micro Devices. The overarching goal of this strategy is to address memory bottlenecks that hinder the progress of larger AI workloads.
Centered around the core concepts of speed, scalability, and data retention, Samsung’s approach comprises three pillars. The first emphasizes high-performance memory, where the company revealed customized high-bandwidth memory and its eighth-generation HBM5. The second pillar leverages CXL technology to extend memory capacity beyond the limitations of individual servers. The third focuses on data storage and management through advanced enterprise SSDs and new storage software solutions. Samsung emphasizes that these three components work synergistically to enhance overall AI system efficiency.
The company linked this comprehensive strategy to the increasing demand for memory driven by AI inference workloads, noting that larger models generate more data during inference and require greater memory resources to store it. Current server designs often limit the available capacity per processor, but Samsung proposed CXL as an innovative way to surpass these restrictions without the need for complete system overhauls. The company also underscored key-value cache optimization, which enables AI models to reuse previously processed data rather than recalculating it repeatedly.
Samsung and AMD Showcase CXL Memory Expansion Solutions
At the summit, Samsung and AMD jointly demonstrated a CXL-based memory expansion solution that allows processors to share memory resources and dynamically scale capacity across AI systems. Samsung confirmed that this solution has been validated in real-world system environments. The two firms signed a memorandum of understanding in March 2026 focused on next-generation AI memory and computing technologies. Moreover, AMD Chief Executive Lisa Su visited South Korea on October 7 to discuss collaboration in memory and foundry operations.
Samsung also exhibited its CMM-D, a CXL-compatible DRAM memory module designed for memory pooling configurations. This setup connects multiple CXL memory units into a shared pool that various systems can access as needed. Other exhibits included processing-in-memory technologies, which perform certain calculations directly within memory chips to reduce data transfer overhead. Samsung displayed 2-nanometer gate-all-around wafers alongside Groq LPU wafers, and Nvidia’s Groq 3 LPX system was also showcased among the company’s exhibits.
Early Access for Partners to Memory Validation Efforts
During an executive session, Shim Ho-jun, Corporate Vice President and head of Samsung’s Application Engineering Team, articulated the importance of expanding memory capacity and bandwidth as AI models grow larger and inference workloads increase. He explained that Samsung is intensifying co-design and technical validation efforts with global partners early in development stages to ensure that memory products align with customer system requirements prior to market release. Samsung’s MAX Lab supports this initiative by enabling clients to test memory and storage solutions under actual AI workloads, allowing validation of technologies such as PIM and next-generation SSDs before they reach commercial deployment. The company’s presence at the summit as a Diamond Sponsor of the Open Compute Project underscores its commitment, following previous presentations at Nvidia GTC in March, COMPUTEX in June, and the Future of Memory and Storage conference in August. Samsung continues to emphasize that expanding memory capacity remains a vital element in enhancing AI infrastructure performance.